SKU 212758 Categoría

QUICK TR1350 Soldering Station HOT-AIR

1,86  Iva Incluido

Descripción

This split-type hot air pen delivers constant airflow, rapid heating, and high efficiency, making it ideal for special applications such as low-temperature rework, large components, and high heat-demand tasks.

Features:

  • Full touchscreen interface with program fast-switching

  • ESD grounding monitoring for safety

  • Network communication capability

  • Quick nozzle replacement

  • Large 1300W power design with smart heat distribution

  • Zone heating: combined preheating and rapid rework

  • Password lock to protect production settings

  • Safety features for sudden power resets

  • Touch-activated sleep mode

  • Constant airflow output, unaffected by nozzle size or deformation

  • Auto identification with alarms for mismatched soldering irons

  • Fast switching between three temperature settings

  • Machine on/off via software with low standby power

  • Real-time ESD grounding monitoring

  • Celsius and Fahrenheit supported

  • Auto power-off to reduce wear and save energy

Applications:

  • Reworking components: SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA, QFN

  • Heat shrinkage, drying, paint removal, defrosting, preheating, sterilization, adhesive soldering

  • Adjustable airflow for small or large volume heating

  • Suitable for lead-free hot air rework

Descripción

Descripción

This split-type hot air pen delivers constant airflow, rapid heating, and high efficiency, making it ideal for special applications such as low-temperature rework, large components, and high heat-demand tasks.

Features:

  • Full touchscreen interface with program fast-switching

  • ESD grounding monitoring for safety

  • Network communication capability

  • Quick nozzle replacement

  • Large 1300W power design with smart heat distribution

  • Zone heating: combined preheating and rapid rework

  • Password lock to protect production settings

  • Safety features for sudden power resets

  • Touch-activated sleep mode

  • Constant airflow output, unaffected by nozzle size or deformation

  • Auto identification with alarms for mismatched soldering irons

  • Fast switching between three temperature settings

  • Machine on/off via software with low standby power

  • Real-time ESD grounding monitoring

  • Celsius and Fahrenheit supported

  • Auto power-off to reduce wear and save energy

Applications:

  • Reworking components: SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA, QFN

  • Heat shrinkage, drying, paint removal, defrosting, preheating, sterilization, adhesive soldering

  • Adjustable airflow for small or large volume heating

  • Suitable for lead-free hot air rework

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