Descripción
Descripción
This split-type hot air pen delivers constant airflow, rapid heating, and high efficiency, making it ideal for special applications such as low-temperature rework, large components, and high heat-demand tasks.
Features:
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Full touchscreen interface with program fast-switching
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ESD grounding monitoring for safety
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Network communication capability
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Quick nozzle replacement
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Large 1300W power design with smart heat distribution
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Zone heating: combined preheating and rapid rework
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Password lock to protect production settings
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Safety features for sudden power resets
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Touch-activated sleep mode
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Constant airflow output, unaffected by nozzle size or deformation
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Auto identification with alarms for mismatched soldering irons
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Fast switching between three temperature settings
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Machine on/off via software with low standby power
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Real-time ESD grounding monitoring
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Celsius and Fahrenheit supported
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Auto power-off to reduce wear and save energy
Applications:
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Reworking components: SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA, QFN
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Heat shrinkage, drying, paint removal, defrosting, preheating, sterilization, adhesive soldering
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Adjustable airflow for small or large volume heating
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Suitable for lead-free hot air rework





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