Descripción

Description

Quick A300T – Professional 3D AOI System for SMT Production Lines

The Quick A300T is an advanced 3D AOI system designed for comprehensive PCB inspection and quality control in modern SMT production lines. It enables electronics manufacturers to detect defects before final assembly. The system supports automatic inspection of PCB boards before and after reflow soldering (pre/post reflow), and high-density electronic modules.

Precise Moiré Technology and Multi-Channel AOI Lighting

The Quick A300T uses a triple-frequency Moiré fringe system, enabling accurate height measurement of components from 5 mm to 45 mm (top) and up to 60 mm (bottom).

In addition, multi-channel, multi-directional lighting (12 channels) allows the system to detect defects even on highly reflective or dark components. This effectively eliminates shadows and reflections, significantly improving inspection accuracy.

Intelligent AI Analysis and Seamless Image Stitching

The Quick A300T uses intelligent AI algorithms to automatically analyze the entire PCB and its solder joints. This increases defect detection accuracy while reducing false alarms. The system can also analyze SMT components of different heights and colors, which is particularly useful for high-density modules. Thanks to seamless image stitching technology, distortions are eliminated and real-time image acquisition is possible at speeds of up to 430 mm/s with 15 μm resolution.

Versatile Applications in the Electronics Industry

The Quick A300T is ideal for inspecting:

• SMT components – detection of missing parts, reversed components, tombstoning, damaged or contaminated elements.

• Solder joints – inspection of excess solder, solder bridges, solder balls, contamination, and insufficient or excessive solder.

• Microvias on FPC – precise inspection of high-density connections, ideal for modern electronic modules.

• Wearable and electronic device modules – full multi-angle inspection, including dispensing and Mylar layer verification.

• DBC/AMB substrates – analysis of die bond and wire bond connections, inspection of deformation and contamination to ensure reliable production.

Comprehensive Solution for the Smart Factory

The Quick A300T integrates offline programming software, SPC systems, and optional Deep Learning and barcode systems, enabling full process control and remote management of PCB inspection. As a result, manufacturers can increase production efficiency, minimize defect risks, and ensure the highest quality of electronic products. Moreover, the system supports intelligent AI analysis for PCB boards, making every production line more precise, efficient, and reliable.