Descripción
Descripción
The EA-H15 uses infrared sensor technology and is controlled by microprocessor. Infrared temperature sensors and infrared heating tubes are untouchable with precise de-soldering components. The soldering process is monitored by non-contact infrared sensors with good process control at any time. Connecting the station with a computer enables the process to be recorded.
Features
● IR infrared reflow soldering system
The infrared temperature sensor directly detects the surface temperature of the BGA to achieve true closed-loop control, ensuring an accurate temperature process window and uniform heat distribution.
● PL precise alignment system
The high-definition optical chromatic aberration prism alignment system is used to align the solder ball and pad by overlapping; scientific and precise, simple control, and easy to mount and release.
● RPC reflow soldering camera
The melting process of the BGA solder ball can be observed from multiple angles from the lateral bearing, providing critical assistance in capturing accurate and reliable process curves.
● BGASOFT control software
PC is connected to record, control, and analyze the entire process flow, and generate a temperature curve to meet the process requirements of the modern electronics industry.
● CONTROL BOX operation keyboard
Multi-functional operation keyboard makes continuous rework more efficient and simple.
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