Descripción
Descripción
The QUICK BGA EA-H00 Rework System is a high-performance solution for soldering and desoldering surface-mount components using infrared heating and microprocessor control. This system combines two integrated modules: the QUICK IR EA-H00 Infrared Rework System and the QUICK PL EA-H00 Precision Placement System.
Engineered to meet the growing demands of modern electronics manufacturing, the EA-H00 system features an upgraded 2400W heating capacity, making it suitable for a wide range of applications—from small to large PCBs and lead-free soldering processes. Its closed-loop temperature control and precision infrared sensor ensure uniform heat distribution, accurate temperature monitoring, and consistent reflow profiles.
A key highlight is the non-contact infrared temperature sensor, which enables real-time process monitoring and nondestructive solder joint temperature calibration. The mid-wavelength IR heater provides even and safe heat application while protecting adjacent temperature-sensitive components—no air flow or special nozzles required. The system operates in an “open environment,” allowing visual inspection and manual calibration during solder melting for precise thermal profiling.
With 10 programmable operation modes and PC connectivity via IR software, users can fully customize temperature profiles and log all process data for quality assurance. Whether used for repair, assembly, or R&D, the QUICK EA-H00 delivers accuracy, flexibility, and professional-grade results in every application.
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